Title:
電気接続テープ
Document Type and Number:
Japanese Patent JP6995621
Kind Code:
B2
Abstract:
A thermal managing electrical connection tape comprising: a carrier film; and a composition including solder powder and soldering flux; wherein the composition contains between 50 wt.% and 70 wt.% soldering flux and between 30 wt.% and 50 wt.% solder powder, the composition being applied to the carrier film, characterized in that the composition is configured to have a suction cup morphology on the bottom of the tape.
Inventors:
Stephen Dane Procopiac
Sanyogita Arora
Ranjit S. Panther
Ellen S. Tomei
Bawa Shin
Sanyogita Arora
Ranjit S. Panther
Ellen S. Tomei
Bawa Shin
Application Number:
JP2017542083A
Publication Date:
January 14, 2022
Filing Date:
February 10, 2016
Export Citation:
Assignee:
ALPHA ASSEMBLY SOLUTIONS INC.
International Classes:
B23K35/14; B23K35/363; B23K35/40; C09J7/10
Domestic Patent References:
| JP2008300443A | ||||
| JP2011123277A | ||||
| JP5921650U | ||||
| JP8250846A | ||||
| JP2001164210A | ||||
| JP61276873A |
Foreign References:
| WO2007125650A1 | ||||
| WO2013062095A1 |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Ryu
Naoko Matsuda
Yoshihiro Ryu
Naoko Matsuda