To provide an electrical contact structure capable of enlarging an electric current, optimizing itself to a counterpart, lowering of a height, without increasing cost.

An FPC 14 arranged with cooper (Cu) foil 40 on both front and reverse sides pinching a polyimide 15 layer is applied with etching treatment or laser treatment from one direction, the cooper foil 40 of the other side (reverse side) is exposed by a plurality of blind hole processing at a predetermined position, and the blind holes 27 are formed and a plurality of through-holes are also formed at the same time, cooper plating 50 is carried out on both front and reverse sides of the cooper foil 40, in the blind holes 27 and the though-holes 22, the both front and reverse sides of the cooper foil 40 are conducted through the blind holes 27 and the through-holes 22.