Title:
回路インターフェースのための電気的マイクロフィラメント
Document Type and Number:
Japanese Patent JP5478890
Kind Code:
B2
Abstract:
Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
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Inventors:
Jacobsen, Stephen Sea
Marceau, David Pea
Churun, Shane
Marceau, David Pea
Churun, Shane
Application Number:
JP2008545751A
Publication Date:
April 23, 2014
Filing Date:
December 12, 2006
Export Citation:
Assignee:
RAYTHEON COMPANY
International Classes:
H01L21/60
Domestic Patent References:
| JP2000323907A | ||||
| JP57104235A | ||||
| JP5283487A | ||||
| JP59175736A | ||||
| JP11219417A |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Omaki Ayako
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Omaki Ayako