Title:
Electrically conductive adhesive, a conductive adhesion sheet, and an electromagnetic wave shield sheet
Document Type and Number:
Japanese Patent JP6183491
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive which can form a conductive adhesive sheet having high adhesiveness on a plated surface and high heat resistance and also having excellent connection reliability, and provide a conductive adhesive sheet and an electromagnetic wave shielding sheet.SOLUTION: An conductive adhesive comprises a thermosetting resin, a curing agent, conductive fine particles, and heterocyclic amine, where the heterocyclic amine has a 5 membered or 6 membered heterocycle, and the curing agent has at least one curing agent (X) selected from the group consisting of isocyanate compound, aziridine compound, and metal chelate compound.SELECTED DRAWING: Figure 1
Inventors:
Shota Inoue
Hidenori Kobayashi
Takahiro Matsuzawa
Tsutomu Hayasaka
Hidenori Kobayashi
Takahiro Matsuzawa
Tsutomu Hayasaka
Application Number:
JP2016059558A
Publication Date:
August 23, 2017
Filing Date:
March 24, 2016
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
Toyochem Co., Ltd.
Toyochem Co., Ltd.
International Classes:
C09J177/02; C09J7/00; C09J9/02; C09J11/04; C09J11/06; H01B1/22; H01B5/14; H05K1/02; H05K9/00
Domestic Patent References:
| JP2011171523A | ||||
| JP5659379B2 | ||||
| JP56005845A | ||||
| JP2003246838A | ||||
| JP2010202695A | ||||
| JP2006219564A | ||||
| JP2009245938A | ||||
| JP2013510220A |
Foreign References:
| WO2008099925A1 | ||||
| WO2011096222A1 | ||||
| WO2007043664A1 | ||||
| US20150195899 |
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