To provide an electrically conductive adhesive intended for electrically connecting an electrode for an electronic component to another electrode and capable of effectively suppressing the oxidation of the electrode for the electronic component even if put under high temperatures and high humidities.

The electrically conductive adhesive comprises electrically conductive particles and a binder resin constituent, wherein the binder resin constituent contains unsaturated bond in the skeleton. An electronic component device is also provided, being such that an electronic component 10 having electrodes 11 and 12 is bonded via this electrically conductive adhesive 13 to the electrode land of a substrate.