Title:
ELECTRICALLY CONDUCTIVE LAMINATE
Document Type and Number:
Japanese Patent JP2002067232
Kind Code:
A
Abstract:
To provide an electrically conductive laminate having a high bond strength of an interface and being excellent in productivity.
The electrically conductive laminate has an insulating base and a conductor layer supported integrally on one main surface of the base at least. The conductor layer is constituted of a resin composition which is prepared by mixing a low-melting metal (b) having a melting point of 300°C or below and a metal powder (c) in a thermoplastic resin or a thermoplastic elastomer (a) as a substrate.
Inventors:
HAYASHI TATSUYA
HIJIYA SHINJI
HIJIYA SHINJI
Application Number:
JP2000262308A
Publication Date:
March 05, 2002
Filing Date:
August 31, 2000
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND
International Classes:
B32B27/18; B32B25/02; C08K3/08; C08L101/12; H01B5/14; (IPC1-7): B32B27/18; B32B25/02; C08K3/08; C08L101/12; H01B5/14
Previous Patent: MULTILAYER STRUCTURE
Next Patent: IMAGE RECORDING BODY AND MANUFACTURING METHOD THEREOF
Next Patent: IMAGE RECORDING BODY AND MANUFACTURING METHOD THEREOF