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Title:
ELECTRICALLY CONDUCTIVE PASTE AND ELECTRICALLY CONDUCTIVE COATING FILM
Document Type and Number:
Japanese Patent JPH04214776
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject paste having excellent long-term adhesivity and migration resistance by using an organic binder comprising a specific copolymer and a curing catalyst.

CONSTITUTION: The objective paste is produced by (1) reacting a hydroxystyrene with a vinyl monomer (e.g. acrylic acid) to obtain a copolymer having a weight- average molecular weight of 1,000-2,000,000 and expressed by formula I [R1 to R3 are 1-5C alkyl, etc.; X is vinyl monomer; Y and Z are group of formula II (M is H, alkali metal, etc.); m≥0 n≥3; k, p and u are 0-2], (2) dissolving the copolymer and optionally a thermosetting resin (e.g. epoxy resin) in a solvent (e.g. benzene), (3) adding a curing catalyst comprising a sulfosuccinic acid diester salt of formula III (R16 is amino, phenyl, etc.; R17 is H or methyl; A is 2-4C alkylene; X1 is CONH, etc.; Z1 is carboxylic acid residue, etc.; M1 is ion forming a salt with Z1; a is 0 or 1; b is 0-100), etc., and (4) compounding preferably 50-95wt.% (based on the cured coating film) of electrically conductive powder such as copper powder.


Inventors:
YAMAMOTO YUZO
HAYASHI HIROMITSU
Application Number:
JP34107790A
Publication Date:
August 05, 1992
Filing Date:
November 30, 1990
Export Citation:
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Assignee:
KAO CORP
International Classes:
C08F220/28; C08F2/44; C08F20/26; C08F22/36; C08F222/02; C08F222/40; C08F290/00; C08F299/02; C08G18/62; C08G59/00; C08G59/40; C08G59/62; C08K3/08; C08L25/00; C08L25/18; C08L63/00; C09D5/24; C09D7/12; C09D125/00; C09D125/18; C09D133/04; C09D133/06; C09D161/04; C09D161/06; C09D161/20; C09D161/28; C09D175/04; H01B1/20; H05K1/09; H05K9/00; (IPC1-7): C08F220/28; C08F222/02; C08F222/40; C08F299/02; C08G18/62; C08G59/40; C08G59/62; C08K3/08; C08L25/18; C09D5/24; C09D7/12; C09D125/18; C09D133/06; C09D161/06; C09D161/28; C09D175/04; H01B1/20; H05K1/09; H05K9/00
Attorney, Agent or Firm:
Yoshinori Hosoda