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Patent Searching and Data


Title:
ELECTRICALLY-CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP57137334
Kind Code:
A
Abstract:

PURPOSE: An electrically-conductive resin composition having improved direct electric plating properties, and plate adhesion, obtained by blending a polyolefin resin with carbon black, sulfur, and trithiolcyanuric acid in a specific ratio.

CONSTITUTION: (A)100pts.wt. polyolefin resin[e.g., propylene homo polymer, etc. (preferably one havng a MI value of ≥20)is blended with (B) 10W60pts.wt. carbon black (preferably electrically-conductive carbon black), (C) 0.1W6pts.wt., preferably 0.3W5pts.wt. sulfur, (D) 0.1W5pts.wt., preferably 0.3W2pts.wt. trithiolcyanuric acid, and, if necessary, an inhibitor for deterioration of metal, etc. by a single screw extruder, etc. preferably in a low-temperature range, to give the desired resin composition. The resin composition can be molded into the given molded article by molding process such as injection molding, etc.


Inventors:
Kawai, Yoichi
Nakamura, Yoshiro
Goto, Yoshihisa
Maki, Masami
Yokote, Yukio
Sekiguchi, Katsumi
Application Number:
JP1981000023147
Publication Date:
August 24, 1982
Filing Date:
February 20, 1981
Export Citation:
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Assignee:
MITSUI TOATSU CHEM INC
International Classes:
C08L23/00; C08K3/04; C08K3/06; C08K5/36; C08K5/37; C08K13/02; C08L7/00; C08L21/00; C08L23/02; C08L101/00; C25D5/56; H01B1/24; (IPC1-7): C08K3/04; C08K3/06; C08K5/36; C08L23/02; C25D5/56