Title:
ELECTRICALLY-CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS58157834
Kind Code:
A
Abstract:
PURPOSE: The titled composition useful for bonding an electronic, or electrical parts to a distributing board, capable of being cured optically to the interior of the resin completely, having improved electrical conductivity, obtained by blending a synthetic resin agent with a small amount of aluminum fibers having a specific diameter and length.
CONSTITUTION: A synthetic resin agent such as epoxy resin, polybutadiene resin, etc. is blended with ≥0.1wt%, preferably 0.1W10% aluminum fibers having ≤0.5mm, preferably 1W100μ diameter and 0.1W10mm, preferably 0.5W5mm length, to give the desired composition.
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Inventors:
TAKAISHI TERUHISA
FUKUSHI HIDEMI
FUKUSHI HIDEMI
Application Number:
JP4100682A
Publication Date:
September 20, 1983
Filing Date:
March 15, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08K7/00; C08K7/06; C08L7/00; C08L21/00; H01B1/22; H05K3/32; (IPC1-7): C08K7/06; H01B1/22
Attorney, Agent or Firm:
Ishida Choshichi