PURPOSE: To improve conductivily through reduction of the coeffieicnt of electric resistance of a polishing tape and to prevent the occurrence of electrification by respectively forming a polishing layer, formed of polishing grains and a binder, on one surface of a substrate sheet and a conductive layer, formed of a high molecular binder and a specified complex, on the other surface thereof.

CONSTITUTION: An electrification preventing tape is formed in such a way that a polishing layer is formed on one surface of a substrate sheet and a conductive layer on the other surface thereof. The polishing layer is formed by applying a mixture of polishing grains and a binder. Meanwhile, the conductive layer is formed by applying a substance where the high molecular binder and a 7, 7, 8, 8-tetracyanoquinodimithane complex are dissolved in an indefectable solvent. A polyester or other resin adhesive is used as the binder. Further, an adhesive formed of polyester and other resin is used as the high molecular binder.