To obtain an electroconductive epoxy resin paste, used for mounting an IC chip on a substrate without causing the stickiness in a state of the B stage, capable of storing or transferring the epoxy resin paste in the state for a long period, then placing the IC chip thereon, curing the paste and thereby mounting the IC chips thereon and further eliminating the need for coating operations on the side of users.

This electroconductive epoxy resin composition comprises (A) 100 pts.wt. epoxy resin composed of (a) 40-60 pts.wt. bisphenol A type epoxy resin having 450-2000 epoxy equiv., (b) 10-40 pts.wt. bisphenol A type epoxy resin having 180-210 epoxy equiv. and (c) 20-50 pts.wt. novolak type epoxy resin, (B) a curing agent comprising 2-6 pts.wt. aromatic diamine and 6-12 pts.wt. dicyandiamide and (C) 25-55 pts.wt. electroconductive powder.