To provide an electroconductive material having excellent heat-resistant strength in which, for example, when used as solder paste, diffusibility of a first metal and a second metal is excellent in a soldering process, an intermetallic compound having a high melting point is generated at low temperature and in a short period of time, and the first metal hardly remains after the soldering, and a connection method and a connected structure using the same with high connection reliability.

The electroconductive material contains metal components consisting of the first metal, and the second metal having a melting point higher than that of the first metal. The first metal is Sn or an alloy containing Sn of ≥70 wt.%. The second metal is a metal or an alloy which generates an intermetallic compound indicating the melting point of ≥310°C with the first metal and in which a lattice constant difference from the intermetallic compound generated around the second metal is ≥50%, as a requirement. Further, the ratio of the second metal in the metal component is ≥30 vol.%. A Cu-Mn alloy or a Cu-Ni alloy is used as the second metal.