Title:
ELECTROCONDUCTIVE PASTE AND ELECTROCONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2004115866
Kind Code:
A
Abstract:
To provide an electroconductive paste which does not need gold fine particles and a resin content, and easily forms a film on a substrate, and to provide a electorconductive film which is made by using it and baked at a relatively low temperature.
The conductive paste includes a complex of a gold ion and amine which is prepared by mixing a solution containing a gold ion with amine, and then kneaded and dispersed in a solvent. The conductive film is obtained by applying the above conductive paste onto a substrate and heating it at a temperature of 200°C or higher but 300°C or lower.
Inventors:
EKUSA EMIKO
KURODA KOTARO
HAYASHI SHIGEHIKO
KURODA KOTARO
HAYASHI SHIGEHIKO
Application Number:
JP2002280542A
Publication Date:
April 15, 2004
Filing Date:
September 26, 2002
Export Citation:
Assignee:
MITSUBOSHI BELTING LTD
International Classes:
C23C18/08; (IPC1-7): C23C18/08
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