Title:
ELECTROCONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2001279102
Kind Code:
A
Abstract:
To prepare an electroconductive paste which has the excellent electromagnetic wave shielding property and electroconductivity in spite of small loads of an electroconductive filler.
The electroconductive paste is formed by blending an electroconductive filler made of cupper microfibers to a thermoplastic resin or a thermosetting resin.
Inventors:
USHIJIMA HITOSHI
AKIBA YOSHINOBU
AKIBA YOSHINOBU
Application Number:
JP2000089332A
Publication Date:
October 10, 2001
Filing Date:
March 28, 2000
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
C08L101/00; C08K3/08; C08K7/06; H01B1/22; H01Q1/36; H01Q17/00; H05K1/09; (IPC1-7): C08L101/00; C08K3/08; C08K7/06; H01B1/22
Attorney, Agent or Firm:
Shohei Oguri (4 outside)