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Patent Searching and Data


Title:
ELECTROCONDUCTIVE POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2004010803
Kind Code:
A
Abstract:

To provide an electroconductive polyoxymethylene resin composition excellent in impact resistance and sliding property while keeping excellent electroconductivity.

This polyoxymethylene resin composition is prepared by compounding 45-94.45 wt% polyoxymethylene resin (A), 5-15 wt% carbon black (B) having not less than 200 mL/100 g oil absorption quantity of dibutyl phthalate, 0.5-30 wt% resin (C) comprising a polyether ester amide (C-1) and an acid-modified olefinic resin (C-2) with the (C-1)/(C-2) ratio in the range of 10/90-90/10 wt%, and 0.05-10 wt% epoxy compound (D).


Inventors:
KUDO SHUICHI
Application Number:
JP2002168098A
Publication Date:
January 15, 2004
Filing Date:
June 10, 2002
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
C08L59/00; C08K3/04; C08K5/1515; (IPC1-7): C08L59/00; C08K3/04; C08K5/1515