Title:
ELECTROCONDUCTIVE RESIN COMPOSITION, ELECTROCONDUCTIVE RESIN CURED PRODUCT, AND ELECTRONIC COMPONENT MODULE
Document Type and Number:
Japanese Patent JP2006137924
Kind Code:
A
Abstract:
To provide an electroconductive resin cured product in which a high connection reliabilty can be acquired.
The electroconductive resin composition for electrically connecting between conductive materials contains an electroconductive powder and a resin material which, after adsorbing on the surface of the conductive material, attains an increase amount in the work function on the above surface of the conductive material to 0.6 eV or less, consequently increasing the value of the Schottky electrical current flowing by the way of the resin material, and is characterized in that the above resin material contains an epoxy resin consisting of a straight-chained hydrocarbon and glycidyl ether.
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Inventors:
NOMURA AKIHIRO
OSAWA TAKASHI
OSAWA TAKASHI
Application Number:
JP2005110079A
Publication Date:
June 01, 2006
Filing Date:
April 06, 2005
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
C08G59/20; C08K3/00; C08L63/00; H01B1/22
Domestic Patent References:
JPS59124972A | 1984-07-19 | |||
JPH08176409A | 1996-07-09 | |||
JP2003168323A | 2003-06-13 | |||
JP2003147046A | 2003-05-21 |
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