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Patent Searching and Data


Title:
ELECTROCONDUCTIVE RESIN COMPOSITION AND ELECTROCONDUCTIVE FLOOR SHEET
Document Type and Number:
Japanese Patent JP62185739
Kind Code:
A
Abstract:

PURPOSE: To obtain a composition which can give a molding which can be freely colored and has a sufficient antistatic property, by adding a specified plasticizer, a phosphoric ester and an electrolyte to a copolymer of vinyl chloride with a monomer having a hydrophilic group and a reactive double bond.

CONSTITUTION: A resin composition prepared by adding a plasticizer of the formula, a phosphoric ester and an electrolyte to a copolymer of vinyl chloride with a monomer having a hydrophilic group and a reactive double bond in the molecule. Said resin composition can give an electroconductive floor sheet by laminating a first floor sheet comprising this composition with a second sheet made of a resin composition formed by adding at least one member selected from among carbon black, carbon fiber, metal powder and metal fiber to a rubber or a plastic and having an electric conductivity larger than that of the first sheet. This floor sheet can show a still more improved antistatic property and is useful for improving the appearance of a floor.


Inventors:
Chiba, Tsukasa
Kimura, Hisami
Nagamori, Hisashi
Kushida, Yuichiro
Harigai, Yasuo
Application Number:
JP1986000027055
Publication Date:
August 14, 1987
Filing Date:
February 10, 1986
Export Citation:
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Assignee:
HITACHI CABLE LTD
DENKI KAGAKU KOGYO KK
International Classes:
B32B27/18; B32B7/02; C08K3/16; C08K5/10; C08K5/11; C08K5/12; C08K5/52; C08L27/06; D06N7/02; E04F15/16; E04F15/18; H01B1/20; H01B5/02; H05F1/00; H05K9/00; B32B27/18; B32B7/02; C08K3/00; C08K5/00; C08L27/00; D06N7/00; E04F15/16; E04F15/18; H01B1/20; H01B5/00; H05F1/00; H05K9/00; (IPC1-7): B32B27/18; C08K5/11; C08K5/12; C08K5/52; C08L27/06; H01B1/20; H01B5/02