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Title:
ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2003183461
Kind Code:
A
Abstract:

To obtain a thermoplastic resin molded article containing an electroconductive material, which is suppressed in deterioration of impact strength caused by incorporation of an electroconductive material component and has excellent surface appearances (excellent gloss and no flow marks) and a satisfactory surface resistivity.

The electroconductive resin composition comprises 10-80 wt.% of a polypropylenic resin obtained by homopolymerization of propylene or random copolymerization of propylene with ethylene, 5-50 wt.% of a linear low density polyethylene as a modifier component obtained by polymerization using a metallocene catalyst, and 5-70 wt.% of at least one electroconductive material selected among carbon black, graphite, metal powder and whisker thereof, metal fiber, metal oxide and carbon fiber. The molded article is obtained using the same.


Inventors:
YOSHIOKA JUNICHI
Application Number:
JP2001390914A
Publication Date:
July 03, 2003
Filing Date:
December 25, 2001
Export Citation:
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Assignee:
TOYO INK MFG CO
International Classes:
C08L23/10; C08K3/04; C08L23/08; H01B1/20; H01B1/24; (IPC1-7): C08L23/10; C08K3/04; C08L23/08; H01B1/20; H01B1/24