Title:
ELECTROCONDUCTIVE RESIN MOLDING
Document Type and Number:
Japanese Patent JP2002020519
Kind Code:
A
Abstract:
To provide an electroconductive resin molding having good electromagnetic wave-shielding properties by improving workability, moldability and the surface appearance of the molded body in obtaining the electroconductive resin molding.
This electroconductive resin molding is obtained by forming an electroconductive film having 0.01-10 μm thickness on a carbon fiber- reinforced thermoplastic resin molding obtained by blending carbon fiber in a specific amount.
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Inventors:
SAKAI HIDETOSHI
OKITA SHIGERU
OKITA SHIGERU
Application Number:
JP2000212057A
Publication Date:
January 23, 2002
Filing Date:
July 12, 2000
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08J7/06; C08J5/04; C08K7/06; C08L101/00; H01B1/24; H05K9/00; (IPC1-7): C08J7/06; C08J5/04; C08K7/06; C08L101/00; H01B1/24; H05K9/00
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