Title:
電気銅めっき方法
Document Type and Number:
Japanese Patent JP6472445
Kind Code:
B2
Abstract:
The method for copper electroplating according to the present invention comprises an aqueous acidic copper plating bath and at least one reverse current pulse cycle consisting of one forward current pulse and one reverse current pulse wherein the fraction of the reverse charge to the forward charge applied to the substrate in said at least one current pulse cycle ranges between 0.1 to 5 %. The method is particularly suitable for simultaneously filling blind micro vias and plating trenches with a rectangular cross-sectional shape.
Inventors:
Andreas Machosek
Olivier Mann
Pamela Cebra
Olivier Mann
Pamela Cebra
Application Number:
JP2016525864A
Publication Date:
February 20, 2019
Filing Date:
October 09, 2014
Export Citation:
Assignee:
Atotech Deutschland GmbH
International Classes:
C25D5/18; C25D3/38; C25D5/02
Domestic Patent References:
| JP2011522962A | ||||
| JP2003213489A | ||||
| JP2003060349A | ||||
| JP2011017036A | ||||
| JP2014508859A | ||||
| JP2009531542A | ||||
| JP2000500529A | ||||
| JP2013503968A | ||||
| JP2016503461A |
Foreign References:
| US20110011746 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima