To effectively eliminates an unwanted waves generated due to chipping formed at a cut part of a piezoelectric raw plate peripheral edge in cutting division into pieces, using a dicing saw right after an electrode forming process by vapor-deposition when a piezoelectric vibrating element, formed by forming exciting electrodes on the main surfaces of a piezoelectric raw plate is mass-produced by batch processing from a large-area piezoelectric base material.

The piezoelectric element 1 is composed of the piezoelectric raw plate 12, having chipping at the peripheral edge and exciting electrodes 13 and 14, which are arranged on both the main surfaces of the piezoelectric raw plate opposite each other, and a suppressing electrode 15, for preventing unwanted vibration from abnormally being reflected, is formed along at least part of the peripheral edges of both the main surfaces.