Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRODE SUBSTRATE, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2008033027
Kind Code:
A
Abstract:

To provide an electrode substrate having conductive layers on both surfaces that can reduce a formation area of external connection terminals and favorably connect a FPC.

The electrode substrate in one embodiment has a first external connection terminal 116 formed on one surface of a second substrate 105 and in the center part on one side of the second substrate 105, and a second external connection terminal 118 formed on a second surface opposite to the first surface and at an end on one side of the second substrate 105, wherein the first external connection terminal 118 is laid so as not overlapping the second external connection terminal 118. The first external connection terminal 116 is formed as extended perpendicular to the end side of the second substrate 105, while the second external connection terminal 118 is formed as extended parallel to the end side of the second substrate 105.


Inventors:
Takahira, Hiroshi
Application Number:
JP2006000206603
Publication Date:
February 14, 2008
Filing Date:
July 28, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OPTREX CORP
International Classes:
G02F1/1345; G02F1/1333; G02F1/1343; G02F1/13