To provide a manufacturing method of an electrode wiring board for plasma display in which the electrode can be formed by a single calcination, and not only metal powder which does not lose conductivity by oxidation but also metal powder which loses the conductivity if it is oxidized is used.

A conductive resin layer is formed from a conductive resin composition containing at least un-oxidized conductive metal powders and organic components on the plate board, exposure and development treatment are applied to the conductive resin layer to form a prescribed pattern, and a dielectric layer is formed by laminating a sheet-shaped uncalcined dielectric layer obtained from an inorganic dielectric paste composition on the plate board having the conductive resin layer patternized by the pattern formation process, and afterwards, by simultaneously calcining the dielectric layer and the patternized conductive resin layer, the dielectric layer and the patternized conductive resin layer are made to be cured while preventing the oxidation of the un-oxidized conductive metal powder.