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Title:
ELECTRODEPOSITED SHEET GRINDSTONE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH01310871
Kind Code:
A
Abstract:

PURPOSE: To improve the chip discharge performance and holding action for the grinding liquid and improve the softness of an electrodeposited sheet grindstone and improve the finished surface roughness by forming an abrasive grain layer by fixing superabrasive grains in metal plating phase only onto the surface of warp.

CONSTITUTION: Superabrasive grains are fixed in metal plate phase only onto the surface of the warp 10 in a basic cloth 12 woven from warp 10 and weft 11, and an abrasive grain layer 13 is formed. Therefore, the exposed part of the warp 11 forms a recessed part 14 on the grinding surface, and the discharge of chips of the electrodeposited sheet grindstone and the holding action for the grinding liquid can be improved by the recessed part 14. Further, the softness of the electrodeposited sheet grindstone can be improved, and the formation of streaks on a ground material is prevented, and the roughness of the finished surface can be improved.


Inventors:
TODA KAZUO
OE JUNYA
Application Number:
JP13977288A
Publication Date:
December 14, 1989
Filing Date:
June 07, 1988
Export Citation:
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Assignee:
MITSUBISHI METAL CORP
International Classes:
B24D11/00; B24D11/02; (IPC1-7): B24D11/00; B24D11/02
Domestic Patent References:
JPS6316974A1988-01-23
JPS5148830A1976-04-27
JPS51274U1976-01-05
Attorney, Agent or Firm:
Masatake Shiga (2 outside)