微小電子機器における銅の電着

Title:

微小電子機器における銅の電着

Document Type and Number:

Japanese Patent JP2007517140

Kind Code:

A

Abstract:

A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a a quaternized pyridinium salt compound for leveling.

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Inventors:

Paneccasio, Vincent
Lynn, Schwan
Figra, Paul
Heart beads, richard

Application Number:

JP2006547095A

Publication Date:

June 28, 2007

Filing Date:

December 13, 2004

Export Citation:

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Assignee:

Enton Incorporated

International Classes:

C25D3/38; C08F8/34; C08F226/06; C25D7/12; H01L21/288; H01L21/768

Domestic Patent References:

JPS57114685A	1982-07-16
JPS527819A	1977-01-21
JPS49135832A	1974-12-27
JP2003105584A	2003-04-09
JP2005126803A	2005-05-19

Attorney, Agent or Firm:

Teruo Akimoto

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