Title:
半導電性基板への誘電コーティングの電着
Document Type and Number:
Japanese Patent JP2011515583
Kind Code:
T
Inventors:
Wilson and Craig Ey.
Sun Dara and Michael G.
パウリック and Michael Jay.
Moore and Kelley El.
Sun Dara and Michael G.
パウリック and Michael Jay.
Moore and Kelley El.
Application Number:
JP2011500918T
Publication Date:
May 19, 2011
Filing Date:
March 18, 2009
Export Citation:
Assignee:
PPG Industries Ohio and in condominium lei テッド
International Classes:
C25D13/06; C25D13/12
Attorney, Agent or Firm:
Takaaki Yasumura
Shusaku Yamamoto
Natsuki Morishita
Shusaku Yamamoto
Natsuki Morishita