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Title:
ELECTRODEPOSITION MATERIAL, METHOD FOR FORMING ELECTRODEPOSITION COATING FILM AND SLIDING DEVICE USING THE MATERIAL
Document Type and Number:
Japanese Patent JP2002020893
Kind Code:
A
Abstract:

To provide an electrodeposition material by which the adhesion to a work is increased without deteriorating the heat resistance of polyamide-imide, and the cracking of an electrodeposition coating film is eliminated, a method for forming the electrodeposition coating film and a sliding device using the material.

The electrodeposition material contains a polyamide-imide material as the main component and is formed by introducing polydimethylsiloxane into the molecular chain of the polyamide-imide material by copolymerization. Polyfluoroethylene is added to the electrodeposition material. The sliding face of the sliding device is coated with the electrodeposition material. Polydimethylsiloxane is introduced into the molecular chain of a polyamide-imide material by copolymerization, polytetrafluoroethylene is added, dry N-methylpyrrolidone is added, the admixture is agitated, triethylamine is added, and the product is electrodeposited on the work as the electrodeposition material and fired to form an electrodeposition coating film.


Inventors:
Fukuzawa, Takahisa
Kuwazawa, Takafumi
Shirai, Hiroyoshi
Kimura, Mutsumi
Ishii, Hidekazu
Application Number:
JP2000000204710
Publication Date:
January 23, 2002
Filing Date:
July 06, 2000
Export Citation:
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Assignee:
SANKYO SEIKI MFG CO LTD
International Classes:
F16C33/20; C08G77/455; C25D13/06; C25D13/12; F16C33/04; C08G77/00; C25D13/04; C25D13/12; (IPC1-7): C25D13/06; C08G77/455; C25D13/12; F16C33/20