To provide an electrodeposition method for use in forming an organic film, by which the organic film can be selectively formed in an area where voltage application is desired such as an electrode while preventing abnormal deposition in an area where voltage is not applied.
According to the method, oxygen plasma is applied to carbon-based contaminants (organic matter) remaining on surfaces of a control electrode 118 and a mobile portion electrode 109, in order to eliminate the contaminants. Next a substrate 101 subjected to oxygen plasma treatment, is treated with an hydrochloric acid, and the substrate is soaked in a hydrofluoric acid solution of a 0.5% concentration for 30 seconds, for instance. Thereafter the substrate 101 is washed with water, and immediately electrodeposited, whereby the organic film 110 is formed by electrodeposition only on a surface where the control electrode 118 is exposed.
ISHII HITOSHI
SATO NORIO
KUWABARA HIROSHI
MACHIDA KATSUYUKI
| JP2004009177A | 2004-01-15 | |||
| JPS6482092A | 1989-03-28 | |||
| JP2004130448A | 2004-04-30 | |||
| JP2004012668A | 2004-01-15 |
Hiroro Kurokawa
Shigeki Yamakawa
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