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Patent Searching and Data


Title:
ELECTRODEPOSITION POSITIVE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JPH03281671
Kind Code:
A
Abstract:

PURPOSE: To obtain the title composition which has excellent flexibility and adhesiveness, is nontacky at ordinary temperature, and allows close contact of a mask film when printing an image by using a specified block copolymer, an alkali-soluble polyphenol, and a positive sensitizing agent as the constituents.

CONSTITUTION: The title composition comprises 100-5 pts.wt. AB type or ABA type block copolymer (A) containing a high-molecular chain segment having a degree of polymerization of 20-5,000, formed from a radical-polymerizable unsaturated monomer having neither an (anhydrous) carboxyl group nor an amino group and a high-molecular chain segment having a degree of polymerization of 20-5,000, formed from a radical-polymerizable unsaturated monomer containing at least 40mol% radical-polymerizable unsaturated monomer having an (anhydrous) carboxyl group or an amino group; 0-95 pts.wt. alkali-soluble polyphenol (B); and 1-100 pts.wt. positive sensitizing agent (C). This composition is excellent in flexibility and adhesiveness, is nontacky at ordinary temperature, and has excellent resistance both to an etching solution and a plating solution; therefore, when used for, e.g. manufacturing a printed circuit board, it can improve the accuracy of patterning and reduce the fraction defective.


Inventors:
NAKANO YOSHITOMO
HIMORI SHUNICHI
KADA MASUMI
Application Number:
JP8082890A
Publication Date:
December 12, 1991
Filing Date:
March 30, 1990
Export Citation:
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Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
G03F7/039; C09D5/44; H05K3/00; (IPC1-7): C09D5/44; G03F7/039; H05K3/00
Attorney, Agent or Firm:
Nakaya Moriya