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Title:
ELECTROFORMING GRINDING WHEEL AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH05277955
Kind Code:
A
Abstract:

PURPOSE: To perform simple and low-cost manufacture of an electroformed grinding wheel being light and excellent in corrosion resistance by disposing a covering part formed of resin, provided with conductivity, to a rotary body-form substrate part formed of a conductive material and electroforming a grinding grain layer on the surface of the substrate part exposed from the covering part.

CONSTITUTION: An annular member 2 is formed in an annular state by using a metal, such as copper, and used as a substrate. In this case, a groove part 4 peripherally formed in succession is formed on the outer periphery of the annular member 2, and a plurality of protrusion parts 6 are formed on two sides. A covering member 8 made of resin reinforced in a way to mix fibers formed of the fibers of a stainless steel is integrally molded to the annular member 2 through injection molding. In this case, the range, except an outer peripheral part where the groove part 4 is formed, of the annular member 2 is covered with the covering part 8. Further, a grinding grain layer 10 wherein grinding grains are fixed through electric plating is formed on the surface of the outer peripheral part not covered with the covering part. A boss part 11 where a grinding wheel is attached on a shaft is formed in the central part of the annular member 2.


Inventors:
Tetsuji Yamashita
Naoki Shimozen
Application Number:
JP7768692A
Publication Date:
October 26, 1993
Filing Date:
March 31, 1992
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO.,LTD.
International Classes:
B24D3/00; B24D3/06; (IPC1-7): B24D3/06; B24D3/00
Attorney, Agent or Firm:
Masatake Shiga (2 outside)



 
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