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Title:
ELECTROFORMING METHOD AND MANUFACTURING METHOD FOR ELECTROFORMED PRODUCT
Document Type and Number:
Japanese Patent JP2023051451
Kind Code:
A
Abstract:
To provide an electroforming method that can suppress detachment of an electroformed product from an electrocasting master during electroforming and can control the shape of the electroformed product, and a method for manufacturing the electroformed product.SOLUTION: Provided is an electroforming method including a step of forming an electroformed product on a surface of an electrocasting master in an electroforming solution by using the electrocasting master as a cathode. In the electrocasting master, a substrate having conductive properties and a pattern on a surface thereof is provided, a convex surface of the pattern is non-conductive, and a base layer having a sheet resistance of 500 Ω/sq or more is formed in an in-plane direction on at least a part of the surface of the substrate. Also provided is a method for manufacturing the electroformed product.SELECTED DRAWING: Figure 1

Inventors:
UMEZAWA TOMOKAZU
Application Number:
JP2021162130A
Publication Date:
April 11, 2023
Filing Date:
September 30, 2021
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
C25D1/10
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office



 
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