To provide an electroforming method by which the shape of the surface of a metal layer on the side opposite from the face electrically deposited to a matrix can be controlled.
The matrix 11 is fabricated by opening a cavity 15 in an insulating layer 14 formed over the upper face of an electroconductive base material 13. The matrix 11 is arranged in an electrolytic bath, and a voltage is applied thereto, so that a metal is electrically deposited on the bottom face of the cavity 15, thereby to form a metal molding 12 electrically in the cavity 15. If the cavity 15 has a width W, and if the head space between the upper face opening of the cavity 15 and the upper face of a metal layer 18 has a vertical height H, the growth of the metal layer 18 is stopped at the electrodeposition step so that the height H of the head space to be left over the metal layer 18 satisfies: HW/2.85, if W300 m; HW/3.75, if 200 mW300 m; HW/4, if 100 mW200 m; and HW/10, if W100 m.
HATAMURA AKIHIKO
YOSHIDA HITOSHI
YAMASHITA TOSHIO
MIURA YASUHIRO
| JPH04183892A | 1992-06-30 | |||
| JPH0864145A | 1996-03-08 | |||
| JPH08138941A | 1996-05-31 | |||
| JP2001205599A | 2001-07-31 | |||
| JPH03163857A | 1991-07-15 | |||
| JPH05259359A | 1993-10-08 | |||
| JPH04183892A | 1992-06-30 |
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