Title:
ELECTROFORMING METHOD
Document Type and Number:
Japanese Patent JPS5953691
Kind Code:
A
Abstract:
PURPOSE:To decrease the stress over the entire part of an electroforming film and to transfer the reversal shape of a matrix exactly to the electroforming film in the stage of forming the electroforming on the matrix, by forming alternately the electroforming film having a compressive stress value and the electroforming film having a tensile stress value. CONSTITUTION:A current density resulting compressive electrodeposition stress and a current density resulting tensile electrodeposition stress are alternately applied and an electroforming film having a compressive stress value and an electroforming film having a tensile stress value are alternately formed on a matrix of a prescribed shape by electroforming. It is preferred that the total sum of the product of the product of the tensile stress value and the thickness of the electroforming film having tensile stress and the total sum of the product of the compressive stress value and the thickness of the electroforming film having compressive stress are equal but about within 10kg/mm.<2> difference between both may be permitted practically.
Inventors:
OKUDAIRA HIROAKI
KOBAYASHI TOSHIO
FUKAGAWA TAKEO
OKA HITOSHI
KOBAYASHI TOSHIO
FUKAGAWA TAKEO
OKA HITOSHI
Application Number:
JP16385082A
Publication Date:
March 28, 1984
Filing Date:
September 22, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C25D1/00; C25D1/10; (IPC1-7): C25D1/10
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)
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