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Title:
ELECTROHYDRODYNAMIC PUMP
Document Type and Number:
Japanese Patent JP2008141870
Kind Code:
A
Abstract:

To modify the configuration of electrodes in the fluid channel in an EHD (ElectroHydroDynamic) pump to reduce the channel resistance of the EHD pump and simplify the alignment of the electrodes to reduce a production cost.

An electrical insulation pipe is inserted into the small diameter side of a metal taper pipe electrode so that the electrical insulation pipe is in contact with the inner circumferential surface of the taper pipe electrode. A metal rod electrode 2 is inserted into the electrical insulation pipe along the central axis of the electrical insulation pipe. The portion of the metal rod electrode extended from inside the metal taper pipe electrode into the electrical insulation pipe is exposed. The other end of the metal rod electrode is covered with insulating coating and is encircled with the metal taper pipe electrode to form a fluid delivery channel. The exposed portion of the metal rod electrode is opposed to the inside surface of the metal taper pipe electrode. The gap between the metal taper pipe electrode and the metal rod electrode is filled with a fluid in which dissociated ions are produced when an electric field is exerted between both the metal electrodes. Direct-current high voltage is applied to between the metal taper pipe electrode and the metal rod electrode.


Inventors:
Hanaoka, Ryoichi
Takada, Shinzo
Fukami, Tadashi
Application Number:
JP2006000325678
Publication Date:
June 19, 2008
Filing Date:
December 01, 2006
Export Citation:
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Assignee:
KANAZAWA INST OF TECHNOLOGY
International Classes:
H02K44/04; F04B9/00
Domestic Patent References:
JPS5962359A
JP2006158169A
Foreign References:
US20060250746A1
US3156847A
Attorney, Agent or Firm:
小鍜治 明