Title:
ELECTROLESS COMPOSITE PLANTING DEVICE
Document Type and Number:
Japanese Patent JP3172029
Kind Code:
B2
Abstract:
PURPOSE: To easily and uniformly disperse grains in a plating tank to suppress a run away reacton by forming the plating device with a first tank contg. an electroless nickel plating soln. and a second tank contg. a heating medium, covering the periphery of the first tank and heating the plating soln. indirectly.
CONSTITUTION: A composite plating bath, in which grains are dispersed in an electroless nickel plating soln. to conduct plating by chemical reduction, is used to apply electroless nickel composite plating to a material to be plated. At this time, the composite plating bath consists of an inner tank 2 contg. a plating soln. and an outer tank 1 covering the periphery of the tank 2 and contg. a heating medium to indirectly heat the plating soln. in the tank 2. The outside of the outer tank 1 is supported by struts 3, the tank 2 has a conical bottom 4 at an incliniation of ≥45°, and a plating soln. circulating pipe 5 is fixed to the tip of the bottom 4. As a result, the plating film forming rate is accurately controlled without complicating the device structure.
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Inventors:
Yuzuru Kudo
Kunio Ikeda
Katsuyuki Ohkubo
Kunio Ikeda
Katsuyuki Ohkubo
Application Number:
JP3801894A
Publication Date:
June 04, 2001
Filing Date:
March 09, 1994
Export Citation:
Assignee:
株式会社リコー
International Classes:
C23C18/31; C23C18/52; (IPC1-7): C23C18/52
Domestic Patent References:
| JP1275771A | ||||
| JP5822972U | ||||
| JP6260256U |
Attorney, Agent or Firm:
Gunichiro Ariga