ELECTROLESS PLATING METHOD, AND APPARATUS THEREOF

Title:

ELECTROLESS PLATING METHOD, AND APPARATUS THEREOF

Document Type and Number:

Japanese Patent JP2001355074

Kind Code:

A

Abstract:

To provide an electroless plating method capable of consistently and uniformly forming a barrier layer by the electroless plating treatment and reducing the use of a chemical, and an apparatus thereof.

In this electroless plating method for forming the barrier layer by implementing the electroless plating on a surface to be plated, a work 40 to be plated is fixed on a rotatable base 4 at least in one of a pre-treating step of the electroless plating and an electroless plating step, the plating chemical 43 is fed onto the surface to be plated of the work 40 from a nozzle 42, etc., a plating film 43a is formed by raising the plating chemical, and after the treatment, the plating chemical is overshot and removed by rotating the base 4. Alternatively, the plating chemical containing the complexing agent and the reducing agent of ≥3 mols based on a first metal material of 1 mol mainly constituting a plating film, and prepared to ≥pH 9 is accommodated and used under the inert gas or ammonium atmosphere.

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Inventors:

SEGAWA YUJI
YUBI HIROSHI
SUZUKI MASATOSHI
WATANABE KATSUMI
SATO SHUZO

Application Number:

JP2000269893A

Publication Date:

December 25, 2001

Filing Date:

September 01, 2000

Export Citation:

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Assignee:

SONY CORP

International Classes:

C23C18/16; C23C18/31; H01L21/28; H01L21/288; H01L21/3205; C23C18/18; H01L21/768; H01L23/52; (IPC1-7): C23C18/16; C23C18/31; H01L21/28; H01L21/288; H01L21/3205

Attorney, Agent or Firm:

Takahisa Sato

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