Title:
電解液の給排液方法
Document Type and Number:
Japanese Patent JP7186950
Kind Code:
B2
Abstract:
To provide a supply and drain method of electrolytic solution, capable of improving productivity through homogenizing a copper ion concentration in electrolytic solution in an electrolytic bath and suppressing passivation of an anode, when performing electrolytic refining of copper with high current density.SOLUTION: In a supply/drain method of electrolytic solution to/from an electrolytic bath that performs electrolytic refining of a metal, a plurality of electrodes are arranged in parallel to each other inside the electrolytic bath. The supply/drain method of electrolytic solution is configured to: supply solution from a solution supply port disposed on one side of an electrolytic bath wall in a normal direction of a surface of each of the electrodes, to a lower part with respect to a bottom edge of the electrodes; and drain from drain ports at a lower part and upper part of an electrolytic bath wall facing the electrolytic bath wall.SELECTED DRAWING: Figure 3
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Inventors:
Hideki Ohara
Asano Satoshi
Jiro Nakanishi
Asano Satoshi
Jiro Nakanishi
Application Number:
JP2019021884A
Publication Date:
December 12, 2022
Filing Date:
February 08, 2019
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C25C7/06; C25C1/12
Domestic Patent References:
| JP45031041B1 | ||||
| JP60070196A | ||||
| JP6065706B2 | ||||
| JP2013108135A |
Foreign References:
| CN105506670A |
Attorney, Agent or Firm:
Yoshitaka Oshida
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