Title:
キャリア箔付電解アルミニウム箔
Document Type and Number:
Japanese Patent JP7247611
Kind Code:
B2
Abstract:
To solve a problem in which a conventional electrode, circuit, or the like is formed with a copper foil and generally has high thermal conductivity and low electric resistivity, but a circuit board and other components are susceptible to stress making an ultrasonic junction difficult, and further, when aluminum is used as an electrode, a circuit, or the like of a printed circuit board, it is thought that aluminum is difficult to handle and it is difficult to manufacture an ultrathin aluminum foil itself because aluminum has a lower rigidity and yield strength compared to copper.SOLUTION: In the present invention, an electrolytic aluminum foil with a carrier foil is provided having an electrolytic aluminum foil layer electrically deposited on the surface of the carrier foil through a junction interface layer.SELECTED DRAWING: Figure 1
Inventors:
Atsushi Okamoto
Koji Sato
Koji Sato
Application Number:
JP2019015033A
Publication Date:
March 29, 2023
Filing Date:
January 31, 2019
Export Citation:
Assignee:
Proterial Co., Ltd.
International Classes:
C25D1/04; B32B15/20; H05K1/09
Domestic Patent References:
| JP2015067872A | ||||
| JP2014051743A | ||||
| JP2017048444A |
Foreign References:
| WO2018131961A1 | ||||
| WO2018131962A1 | ||||
| WO2018131964A1 | ||||
| WO2012063920A1 |
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