To provide an electrolytic copper foil having tensile strength at room temperature of 650 MPa or more, tensile strength after 300°C×1 hour of heat treatment of 450 MPa or more, and conductivity of 80% or more, to provide the electrolytic copper foil excellent in mechanical strength on a printed circuit for lamination with a polyimide film, and further to provide the electrolytic copper foil which is not deformed or broken as a collector of a lithium ion secondary battery (copper foil).
An electrolytic copper foil contains tungsten and the balance copper. Preferably tungsten is incorporated in the copper foil as a copper alloy, tensile strength at room temperature is 650 MPa or more, tensile strength after 300°C×1 hour of heat treatment is 450 MPa or more, and conductivity is 80% or more. Further preferably, elongation at a room temperature of 2.5% or more, elongation after 300°C×1 hour of the heat treatment is 3.5% or more. The electrolytic copper foil is manufactured by adding a thiourea-based compound, a tungsten salt, and a chloride ion to sulfuric acid-copper sulfate-based electrolyte, and by electrolytic deposition.
SHINOZAKI KENSAKU
FUJISAWA KIMIKO
TSURUTA TAKAHIRO
EZURA KEN
SHINOZAKI ATSUSHI
EBISUGI MASATO
SASAKI HIROKAZU
YAMAZAKI SATOSHI
| JPH07278867A | 1995-10-24 | |||
| JPH0967693A | 1997-03-11 | |||
| JPH10330983A | 1998-12-15 | |||
| JPH11152593A | 1999-06-08 | |||
| JP2004263296A | 2004-09-24 |
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