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Title:
ELECTROLYTIC COPPER ALLOY FOIL, AND ELECTROLYTIC COPPER ALLOY FOIL WITH CARRIER FOIL
Document Type and Number:
Japanese Patent JP2013112891
Kind Code:
A
Abstract:

To provide an electrolytic copper alloy foil having excellent laser beam machinability, and capable of providing the uniform etching rate in the thickness direction in the subsequent etching.

The electrolytic copper alloy foil is obtained by electrolyzing electrolytic solution and contains, by mass, tin of 8-25%. In the electrolytic copper alloy foil, crystal grains in the crystal structure are preferably columnar crystal extending in the thickness direction.


Inventors:
MATSUDA MITSUYOSHI
YOSHIKAWA KAZUHIRO
FUJIMOTO NOBUO
Application Number:
JP2011263093A
Publication Date:
June 10, 2013
Filing Date:
November 30, 2011
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C25D1/04; C25D7/06; H05K1/09
Domestic Patent References:
JP2000017476A2000-01-18
JP2003041334A2003-02-13
JP2000017476A2000-01-18
JP2003041334A2003-02-13
Foreign References:
WO1997043466A11997-11-20
WO1997043466A11997-11-20
Attorney, Agent or Firm:
Katsuhiro Yoshimura



 
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