引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法

Title:

引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法

Document Type and Number:

Japanese Patent JP7211669

Kind Code:

B2

Abstract:

An embodiment of the present invention provides an electrolytic copper foil, which comprises a copper layer and has a valley mean roughness of 0.8 to 12.5, a texture coefficient of (220) face (TC(220)) of 0.49 to 1.28, a tensile strength of 25 to 51 kgf/mm², and a weight deviation in lateral direction of 3% or less.

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Inventors:

Kim Seung Min
Jun Ins
Kim Young Tae
Jun San Hyun

Application Number:

JP2021551986A

Publication Date:

January 24, 2023

Filing Date:

November 13, 2020

Export Citation:

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Assignee:

SK Nexilis Company Limited

International Classes:

C25D1/04; C23C26/00; C25D1/00; H01M4/66

Domestic Patent References:

JP2018111882A
JP2018032624A
JP2001505955A

Foreign References:

US20190003066
WO2019027174A1

Attorney, Agent or Firm:

Satoshi Watanabe

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