Title:
引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法
Document Type and Number:
Japanese Patent JP7324297
Kind Code:
B2
Abstract:
The present invention relates to a method of manufacturing an electrolytic copper foil, the method comprising:preparing an electrolyte; andperforming electroplating using the electrolyte to form a copper layer,wherein the electrolyte includes copper ions at a concentration of 50 g/L to 100 g/L, a sulfuric acid at a concentration of 50 g/L to 150 g/L, chlorine (Cl) at a concentration of 1 ppm to 50 ppm, lead ions (Pb2+) at a concentration of 0.25 g/L, and an organic additive, andthe formation of the copper layer includes applying a current at a current density of 40 A/dm2 to 80 A/dm2 between an electrode plate and a rotating drum disposed to be spaced apart from each other in the electrolyte.
Inventors:
Kim Yun Tae
Jun San Hyun
Lee John Gil
Kim Seung Min
Jun San Hyun
Lee John Gil
Kim Seung Min
Application Number:
JP2021548179A
Publication Date:
August 09, 2023
Filing Date:
November 05, 2020
Export Citation:
Assignee:
SK Nexilis Company Limited
International Classes:
C25D1/04; H01M4/66
Domestic Patent References:
| JP2001295090A | ||||
| JP2021512214A | ||||
| JP2020532653A |
Foreign References:
| KR1020190009048A | ||||
| US20190017188 | ||||
| US20190006658 | ||||
| KR1020170088614A |
Attorney, Agent or Firm:
Kazuhiro Ohta
Satoshi Watanabe
Satoshi Watanabe
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