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Title:
ELECTROLYTIC COPPER FOIL, CARRIER FOIL-FITTED ELECTROLYTIC COPPER FOIL AND PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2015193884
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electrolytic copper foil capable of effectively preventing circuit peeling caused by insertion or the like in an etching stage upon circuit formation, thus contributing to the facilitation of fine line processing and the improvement of circuit yield.SOLUTION: Provided is an electrolytic copper foil having a surface surface-treated at least using zinc, the treated surface and the vicinity thereof include zinc at a coating weight of 5 to 20 mg/mderived by the surface treatment, and also, in the case the treated surface is analyzed by XPS (X-ray photoelectron spectroscopy), the ratio of Cu occupied in the total content of Cu, C, N, O, Si, Cr, Ni and Zn is 20 at% or lower expressed in terms of the element, and also provided is a carrier foil-fitted electrolytic copper foil using the same.

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Inventors:
TAKANASHI AKITOSHI
IWAKIRI KENICHIRO
KAMATA HARUMI
MATSUDA MITSUYOSHI
IIDA HIROTO
Application Number:
JP2014072310A
Publication Date:
November 05, 2015
Filing Date:
March 31, 2014
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C25D7/06; C23C28/00; C25D1/04; C25D5/50; C25D7/00; H05K1/09
Domestic Patent References:
JPH11140683A1999-05-25
JP2011166018A2011-08-25
JP2005254673A2005-09-22
JP2000165037A2000-06-16
JPS52735A1977-01-06
JP2011012297A2011-01-20
JP2014177657A2014-09-25
JPH07231152A1995-08-29
JP2011114204A2011-06-09
JP2011210994A2011-10-20
JP2011014647A2011-01-20
Foreign References:
WO2012046804A12012-04-12
WO2004005588A12004-01-15
WO2011001552A12011-01-06
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima



 
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