Title:
Electrolytic copper foil, electrolytic copper foil manufacturing method, copper-clad laminate, printed wiring board, printed wiring board manufacturing method and electronic device manufacturing method
Document Type and Number:
Japanese Patent JP6328821
Kind Code:
B2
Inventors:
Kenji Inukai
Yosuke Kobayashi
Kazuhiko Iida
Yosuke Kobayashi
Kazuhiko Iida
Application Number:
JP2017092706A
Publication Date:
May 23, 2018
Filing Date:
May 08, 2017
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/04
Domestic Patent References:
| JP9143785A | ||||
| JP2004107786A | ||||
| JP2008118163A | ||||
| JP2015134953A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation