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Title:
ELECTROLYTIC COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2012172198
Kind Code:
A
Abstract:

To provide an electrolytic copper foil capable of reducing any warp caused by the thermal load, in particular, an electrolytic copper foil useful for a secondary battery negative electrode current collector, and a method for manufacturing the same.

In the method for manufacturing the electrolytic copper foil 4, for the electrolytic copper foil 4, the difference in Vickers hardness (Hv) of the front and the back surfaces of the electrolytic copper foil 4 or the electrolytic copper foil 4 after treatment is ≤10. In the electrolytic copper foil 4, the warp of the electrolytic copper foil 4 or the electrolytic copper foil 4 after the treatment is ≤1 mm. The electrolytic copper foil 4 or the electrolytic copper foil 4 after the treatment is heated in an oven at the temperature of 130-155°C, and the distortion of the electrolytic copper foil 4 or the electrolytic copper foil 4 after the treatment is removed.


Inventors:
MINAGAWA YOICHI
Application Number:
JP2011035395A
Publication Date:
September 10, 2012
Filing Date:
February 22, 2011
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04; H01M4/66
Domestic Patent References:
JP2003086186A2003-03-20
JP2001126734A2001-05-11
JP2001214299A2001-08-07
JP2009221592A2009-10-01
JP2000182623A2000-06-30
JP2010260369A2010-11-18
JPS4410381B
Foreign References:
WO2008132987A12008-11-06
Attorney, Agent or Firm:
Isamu Ogoshi