Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTROLYTIC COPPER FOIL AND METHOD FOR PRODUCING ELECTROLYTIC COPPER FOIL
Document Type and Number:
Japanese Patent JP2012211351
Kind Code:
A
Abstract:

To provide an electrolytic copper foil that has high normal tensile strength, a low decrease in tensile strength after a thermal history, and low concentration of impurities in the copper foil, and to provide a method for producing the electrolytic copper foil.

In the electrolytic copper foil, the concentration of sulfur is 10-50 mass ppm inclusive, lattices having 10 nm gaps are formed with respect to a STEM image obtained at a million times magnification by means of a scanning transmission electron microscope, and when measuring the sulfur concentration with the intersections of the lattices as the measurement points, there are measurement points at which the concentration of sulfur is higher compared to the concentration of sulfur in the copper foil.


Inventors:
KOHIKI MICHIYA
Application Number:
JP2011076638A
Publication Date:
November 01, 2012
Filing Date:
March 30, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04
Domestic Patent References:
JPH1036992A1998-02-10
JP2002053993A2002-02-19
JP2009221592A2009-10-01
Attorney, Agent or Firm:
Axis International Patent Business Corporation