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Title:
ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2015113521
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electrolytic copper foil which has high glossiness and can be produced in a short period of time.SOLUTION: There is provided the electrolytic copper foil that has an area ratio occupied by a (100) plane in which deviation from <001> crystal orientation is 18° or less, of 10% or more when a surface is analyzed by an electron back scatter diffraction method (EBSD), and at least one of surfaces of the electrolytic copper foil has glossiness G(20°) equal to or more than 1500 measured in compliance to JIS Z 8741-1997.

Inventors:
MATSUURA YOSHINORI
NAKAMURA TOSHIMI
MYOI MASAHARU
WATANABE HAJIME
Application Number:
JP2013258566A
Publication Date:
June 22, 2015
Filing Date:
December 13, 2013
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C25D1/04; H01B5/02; H01L51/50; H05B33/26
Domestic Patent References:
JP2005076091A2005-03-24
JP2009020920A2009-01-29
JP2009231309A2009-10-08
JP2009185384A2009-08-20
JP2005076091A2005-03-24
JP2009020920A2009-01-29
JP2009231309A2009-10-08
JP2009185384A2009-08-20
Foreign References:
WO2013002275A12013-01-03
WO2011152092A12011-12-08
WO2006106956A12006-10-12
WO2013002275A12013-01-03
WO2011152092A12011-12-08
WO2006106956A12006-10-12
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima