Title:
電解銅箔、該電解銅箔を用いた表面処理銅箔、並びに該表面処理銅箔を用いた銅張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP7247015
Kind Code:
B2
Abstract:
To provide an electrolytic copper foil that is thin, has less pinholes, and is excellent in smoothness, but that is not a copper foil with carrier; a surface-treated copper foil using the electrolytic copper foil; a copper-clad laminate using the surface-treated copper foil; and a printed circuit board.SOLUTION: An electrolytic copper foil, the foil except copper foils with carrier, has a thickness of not more than 9 μm, in which the existence density of pinholes with longitudinal dimensions of 2-10 μm is not more than 800 per the area 1 m2 of the electrolytic copper foil.SELECTED DRAWING: Figure 2
Inventors:
Ryoji Takasawa
Application Number:
JP2019088238A
Publication Date:
March 28, 2023
Filing Date:
May 08, 2019
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D1/04; B32B15/08; C25D5/16; C25D7/06; H05K1/09
Domestic Patent References:
| JP2013053362A | ||||
| JP55100991A | ||||
| JP2001342589A | ||||
| JP2000087292A | ||||
| JP2006032984A |
Foreign References:
| WO2018181061A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office