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Title:
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL, METHOD FOR MANUFACTURING ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND COPPER CLAD LAMINATE OBTAINED USING ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
Document Type and Number:
Japanese Patent JP2014005545
Kind Code:
A
Abstract:

To provide an electrolytic copper foil with a peelable type carrier foil, capable of easily peeling the carrier foil even when heated at a temperature over 300°C.

In an electrolytic copper foil 1 with a carrier foil, having a layer structure of a carrier foil 2, a junction interface layer 3, a heatproof metal layer 5 and an electrolytic copper foil layer 4, an electrolytic copper foil having a predetermined surface roughness (Rzjis), glossiness [Gs(60°)], etc., is used as the carrier foil. In a GDS analyser, used are the electrolytic copper foil with the carrier foil etc., satisfying a relationship of ([W2]-[W1])/[W1]≤0.3, where W1 represents the half width of a peak when a component profile in a depth direction of the heatproof metal layer is measured toward a carrier foil side from an electrolytic copper foil layer side of the electrolytic copper foil with a carrier foil, and W2 represents the half width of a peak when a component profile in a depth direction of the heatproof metal layer is measured after the electrolytic copper foil with a carrier foil is heated at a temperature of 300°C.


Inventors:
TSUYOSHI HIROAKI
OBATA SHINICHI
TATSUOKA AYUMI
Application Number:
JP2013179909A
Publication Date:
January 16, 2014
Filing Date:
August 30, 2013
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C25D7/06; C25D1/04; H05K1/09
Domestic Patent References:
JP2007217787A2007-08-30
JP2007217787A2007-08-30
Attorney, Agent or Firm:
Katsuhiro Yoshimura