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Title:
ELECTROLYTIC COPPER FOIL WITH HIGH TENSILE-STRENGTH, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2008285727
Kind Code:
A
Abstract:

To provide an electrolytic copper foil which is not softened in a period while being stored at ordinary temperature after the foil production process of the copper foil has been finished and before the next manufacturing process starts, or by heat treatment to be conducted at about 200 to 300C in the next process, and maintains its high tensile-strength, and to provide a manufacturing method therefor.

The electrolytic copper foil with high tensile-strength has a tensile strength of 400 N/mm2 or higher which has been measured at 25C after the foil production process of the copper foil has been finished and after the characteristics of the copper foil have been stabilized. A period of time necessary for the characteristics to become stable after the foil production process has been finished is preferably 48 hours or longer and further preferably is 72 hours or longer.


Inventors:
SAITO TAKAHIRO
MATSUMOTO SADAO
SUZUKI YUJI
Application Number:
JP2007132581A
Publication Date:
November 27, 2008
Filing Date:
May 18, 2007
Export Citation:
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Assignee:
FURUKAWA CIRCUIT FOIL KK
International Classes:
C25D1/04
Domestic Patent References:
JP2008133513A2008-06-12
JP2006152420A2006-06-15
JP2002298854A2002-10-11
JP2001523303A2001-11-20
JPH11501268A1999-02-02
JP2002129373A2002-05-09
JPH0853789A1996-02-27
JP2006299320A2006-11-02
JP2004263289A2004-09-24
JPH0488185A1992-03-23
JPH07188969A1995-07-25
JP2004339558A2004-12-02
JP2001123290A2001-05-08
JP2008101267A2008-05-01
Foreign References:
WO1997043466A11997-11-20
WO2006080148A12006-08-03
Attorney, Agent or Firm:
Takahisa Sato